The epitaxial wafer is finding application across automotive, military, aerospace, medical and industrial applications

The epitaxial wafer is finding application across automotive, military, aerospace, medical and industrial applications

An epitaxial wafer (or epi wife, epi-wired wife, wafers, epi-stick, Epix-wired, Epix-wave) is a solid wafer made out of a solid semiconductor material such as silicon or gallium arsenide. The term "epi" stands for "on" or "through" and "wafers" means "wedges". Epitaxial wafers are used in applications where heat is a factor, such as photonics and microelectronics. Photonics and microelectronics are two of the most widely used applications in today's telecommunications industry.

In its early inception, this wafer was designed for the manufacture of flat panel displays. They have since found applications in other electronic areas, including automotive, military, aerospace, medical and industrial applications. In the past, it was difficult for manufacturers to obtain large quantities of flexible substrates that would support a large display. The introduction of a gallium arsenide semiconductor on the other hand has made it possible to create large quantities of the wafer while also offering the ability to produce a smaller, lighter, and more versatile product. The versatility and lightweight provided by this substrate have helped to make it highly suitable for a variety of electronic applications.




The surface of the wafer is made from a multi-layered, highly durable Wafer that is comprised of numerous small layers. When these layers are fused, the result is an extremely tough, scratch-resistant, flat-panel Wafer that can be used in applications where high wear resistance is necessary. It is important to note that while the wafer is designed to provide superior scratch resistance to various chemicals, combustible liquid handling is not recommended.

The manufacturers currently produce two series of wafers with a production rate of one wafer per minute. The i-v semiconductor series was initially introduced in the market in 2021. It uses mbe (medium-density boron nitride) as a source of the material. The iii-v semiconductor series was introduced in the market in the year 2021. The iii-v series is more suitable for use in devices requiring high power density and therefore is used mainly in device packages such as laptop batteries and electric cars. Since both series have recently been introduced in the market.

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